As demand for application-specific silicon continues to accelerate across AI, communications, and edge computing, RightSilicon took the stage at the GlobalFoundries Technology Summit (GTS 2026), presenting its turnkey ASIC solutions from product specification to silicon.

At the summit, RightSilicon shared with attendees its turnkey ASIC flow, which covers product specification, architecture & RTL design, IP integration, physical design, tape-out, packaging and test, and logistics, and highlighted its expanding portfolio of silicon-proven IP qualified on GlobalFoundries multiple process platforms.

One of the core themes showcased by RightSilicon is its deep design expertise on GlobalFoundries process. The company introduced its success stories based on GF processes, including Neural Processor and High-Frequency Instrumentation based on GF 22FDX® platform, High-Speed Communication Products on GF 45RF-SOI, and High Power Management Devices for AI Data Centers on GF 55nm BCD.

RightSilicon’s high-value & low-risk custom ASIC design can meet customers’ specific needs in various application scenarios, such as 5G, AI, HPC, edge computing, communication & network equipment, IoT, and Automotive, which has stringent requirements for performance, power, and time-to-market.

About RightSilicon

RightSilicon provides ASIC design services and turn-key manufacturing services, including specification design, SoC design, IP, physical design, post simulation, post verification, packaging design, testing and logistics.

For more information, please visit www.rightsilicon-tech.com